CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Research and Development

Resumen

The CHIPS Research and Development Office (CHIPS R&D) intends to announce, via a Notice of Funding Opportunity (NOFO), an open competition for new research and development (R&D) activities to establish and accelerate domestic capacity for semiconductor advanced packaging. The purpose of this NOI is to offer preliminary information to potential applicants, facilitating the development of meaningful partnerships and strong, responsive proposals relevant to one or more of five R&D areas: Equipment, Tools, Processes, and Process Integration; Power Delivery and Thermal Management; Connector Technology, Including Photonics and Radio Frequency (RF); Chiplets Ecosystem; and Co-design/Electronic Design Automation (EDA). In addition to the R&D areas, the NOFO is expected to include a specific opportunity for prototype development in exemplar application areas such as high-performance computing and low-power systems needed for AI.