Notice of Intent To Grant an Exclusive, Partially Exclusive or Non-Exclusive License of the United States Patent Application No. 13/543,217 Filed July 06, 2012 Entitled ”Tie-Down and Jack Fitting Assembly for Helicopter”

요약

In accordance with 35 U.S.C. 209 and 37 CFR 404.7 (a)(l)(i), announcement is made of a prospective exclusive, partially exclusive, or non-exclusive license of the following U.S. Patent Application 13/ 543,217 Filed July 06, 2012 to Envoy Flight Systems, Incorporated with its principal place of business at 201 Ruther Drive, Suite 3, Newark, DE 19711.