International trade · 28/05/2008

Notice of Investigation into Semiconductor Chip Package Size and Patent Infringement

The U.S. International Trade Commission has received a complaint alleging that Tessera, Inc. of San Jose, California, is seeking to investigate the importation of certain semiconductor chips with minimized chip package size and products containing the same, which it claims infringe on U.S. Patent No. 5,679,977, U.S. Patent No. 5,852,326, and U.S. Patent No. 6,433,419. The complainant is requesting that the Commission institute an investigation and issue exclusion orders and cease and desist orders.