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Handel i gospodarka · 1.02.2024

CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates Research and Development

The CHIPS Research and Development Office intends to announce an open competition for research and development activities to establish domestic capacity for advanced packaging substrates and substrate materials, with up to $300,000,000 available over 5 years.

Source: Federal Register — Department of CommerceOpen original release →