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Business · 31/07/2012

Letters of Interest for Credit Assistance Under the Transportation Infrastructure Finance and Innovation Act (TIFIA) Program

The U.S. Department of Transportation (DOT) is offering $1.75 billion in funding under the Transportation Infrastructure Finance and Innovation Act (TIFIA) program, with a focus on providing credit assistance for eligible surface transportation projects. The funding is made available through the Moving Ahead for Progress in the 21st Century Act (MAP-21), and project sponsors can submit Letters of Interest to access the funds.

Original source language: Federal Register — Transportation DepartmentOpen original release →

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